BISPHENOL A DIGLYCIDYL ETHER RESIN
- Createtime： 2026-04-14
- Updatetime： 2026-09-30
Product Details
| useage |
Industrial use
|
| deliveryInfo |
|
| appearance |
liquid
|
| Molecular Weight |
Oligomer, variable molecular weight
|
| aliasen |
|
| supplyCapacity |
50000MT/Month
|
| harbor |
Qingdao,China
|
| minorder |
1KG
|
| Appearance |
Light yellow viscous liquid
|
Shandong Huashang Chemical Co., Ltd. is a high-tech enterprise focused on industry of fine chemicals research and develop, produce and sale. Shandong Huashang Chemical Co., Ltd. is located in Shan Dong Ji Nan China. we have the ability to provide you high quality products. More than 90 % of our products are exported to developed countries and regions such as north America, Europe, Japan, South Korea and the Middle East.
Basic Information
Product Name: BISPHENOL A DIGLYCIDYL ETHER RESIN
CAS Number: 25068-38-6
Alias: DGEBA, Bisphenol A epoxy resin, BPA diglycidyl ether oligomer
Chemical Full Name: Poly[2,2-bis(4-hydroxyphenyl)propane-co-epichlorohydrin]
Molecular Formula: (C??H??O?)?
Molecular Weight: Oligomer, molecular weight varies with polymerization degree
EINECS: 500-033-5
Structural Information
- Structure Type: Oligomeric bisphenol A type thermosetting epoxy resin
- Structural Features: Repeating unit contains bisphenol A benzene ring skeleton, terminal reactive glycidyl epoxy groups; epoxy groups can cross-link with amine, anhydride, phenolic curing agents to form rigid 3D network; benzene ring endows outstanding mechanical strength, acid & alkali resistance, heat resistance
- Characteristic: The most widely used general-purpose epoxy matrix resin, viscosity and hardness adjustable by molecular weight
Physical & Chemical Properties
- Appearance: Light yellow transparent viscous liquid (low molecular weight liquid grade); off-white solid flakes (high molecular weight solid grade)
- Odor: Slight faint resin odor
- Melting Point: Liquid grade <25°C; solid grade 40–70°C
- Flash Point: >150°C (closed cup)
- Density (20℃): 1.16–1.20 g/cm3
- Solubility: Insoluble in water; miscible with ketones, esters, aromatic solvents, alcohol diluents; compatible with most curing agents, fillers, acrylic resins
- Stability: Stable sealed at room temperature; epoxy ring opens to cross-link under acid, alkali or high temperature; uncrosslinked resin resists dilute acid, dilute alkali and common organic solvents
Synthesis & Applications
Production Method
Polycondensation of bisphenol A and epichlorohydrin under alkaline catalyst, vacuum solvent removal, salt filtration to obtain finished epoxy resin.
Main Applications
- Anti-corrosion Coatings: Floor epoxy paint, container anti-rust coating, electronic insulating varnish, automotive primer
- Structural Adhesives: Metal bonding glue, electronic potting compound, wood composite adhesive
- Composite Materials: Carbon/glass fiber composite matrix, wind turbine blade resin, winding pipeline material
- Electronic & Electrical Materials: PCB copper-clad laminate resin, electronic component encapsulation glue, insulating casting resin
- Construction Engineering: Building reinforcement carbon fiber adhesive, epoxy repair mortar
Safety & Storage Instructions
GHS Hazard Classification
- H315 Causes skin irritation
- H317 May cause allergic skin reaction
- H319 Causes serious eye irritation
- H413 Long-lasting harmful effects to aquatic organisms
Personal Protection
Organic vapor respirator, chemical splash goggles, oil-resistant nitrile gloves, impermeable protective overalls; operate in well ventilated workshop, avoid prolonged direct skin contact.
Storage Condition
Sealed iron drum, cool dry ventilated warehouse ≤30℃; isolate amine curing agents, strong acid, oxidants, avoid direct sunlight.
Transportation
General industrial polymer liquid/solid chemical; prevent drum leakage, separate from food and aquatic goods.
Quality Specifications
- Epoxy Equivalent Weight: 180–5000 g/eq (different product grades)
- Moisture Content: ≤0.1%
- Chroma (Pt-Co): ≤100
- Total Hydrolyzable Chlorine: ≤0.05%
Information Summary Table
| Item | Specification |
| CAS Number | 25068-38-6 |
| Product Name | BISPHENOL A DIGLYCIDYL ETHER RESIN |
| Synonym | DGEBA, BPA Epoxy Resin |
| Molecular Formula | (C21H24O4)n |
| Molecular Weight | Oligomer, variable molecular weight |
| Appearance | Light yellow viscous liquid / off-white solid flakes |
| Core Advantage | High mechanical strength, excellent anti-corrosion performance, universal thermosetting matrix |
| Storage Rule | Hermetically sealed cool storage, separated from acids & amine curing agents |
| Hazard Property | Skin sensitizer, irritates eyes and skin, long-term toxicity to aquatic environment |
| Main Usage | Anti-corrosion coatings, structural adhesives, fiber composites, electronic insulation encapsulation, building reinforcement materials |
